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Multilayer ceramic capacitors
Chip, MLSC, X7R
Series/Type: Date:
Chip February 2009
The following products presented in this data sheet are being withdrawn. Substitute Products: See www.epcos.com/withdrawal_mlcc Ordering Code B37941X5333K060 B37941X5333K070 B37941X5473K060 Substitute Product Date of Withdrawal 2009-06-26 2009-06-26 2009-06-26 Deadline Last Orders 2010-06-30 2010-06-30 2010-06-30 Last Shipments 2010-12-31 2010-12-31 2010-12-31
(c) EPCOS AG 2009. Reproduction, publication and dissemination of this publication, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited.
Ordering Code B37941X5473K070 B37941X5683K062 B37941X5683K072 B37941X5104K062 B37941X5104K072 B37941X1102K060 B37941X1102K070 B37941X1152K060 B37941X1152K070 B37941X1222K060 B37941X1222K070 B37941X1332K060 B37941X1332K070 B37941X1472K060 B37941X1472K070 B37941X1682K060 B37941X1682K070 B37941X1103K060 B37941X1103K070 B37941X1153K060 B37941X1153K070 B37941X1223K060 B37941X1223K070 B37931X5152K060 B37931X5152K070 B37931X5222K060 B37931X5222K070 B37931X5332K060 B37931X5332K070 B37931X5472K060 B37931X5472K070 B37931X5682K060 B37931X5682K070 B37931X5103K060 B37931X5103K070 B37931X1102K060 B37931X1102K070
Substitute Product
Date of Withdrawal 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26 2009-06-26
Deadline Last Orders 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30 2010-06-30
Last Shipments 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31 2010-12-31
For further information please contact your nearest EPCOS sales office, which will also support you in selecting a suitable substitute. The addresses of our worldwide sales network are presented at www.epcos.com/sales.
Multilayer ceramic capacitors MLSC; X7R
Chip
General The MLSC was developed for typical applications with a direct connection to the battery or generator in the automobile, as it satisfies the requirements of the automobile manufacturers for a series connection of two capacitors for battery applications in a single component. It not only represents the only real alternative to the series connection of discrete capacitors, but also offers advantages over these and other possible solutions, which contain only a single capacitor. Compared with a series circuit made up of conventional ceramic capacitors, it allows the number of components to be reduced. This reduces the space requirement on the circuit board and shortens the placement time. Because fewer components are used, the failure probability is additionally reduced. The MLSC is based on proven MLCC technology, but has a more rugged design. This technology offers highest reliability (ppb rate) on the basis of long field experience. Both undamaged and typically cracked MLSCs are characterized by a high breakdown voltage and high ESD and pulse strength. It may be used at temperatures of up to 150 C with consideration of a voltage derating and with brief temperature peaks of up to 175 C without electrical stressing. The MLSC is also manufactured to the specifications of the ppb level assurance system, and a bending strength of 2 mm is assured on the basis of the rigorous piezoelectric method.
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer ceramic capacitors MLSC; X7R
Ordering code system
B37941
Type and size Chip size (inch/mm) = Temperature characteristic X7R: 0603/1608 B37931 0805/2012 B37941 Internal coding "X" indicates MLSC type Rated voltage 5 (Code) 50 VDC 1 (Code) 100 VDC Capacitance, coded (example) 103 10 103 pF = 10 nF 104 10 104 pF = 100 nF 223 22 103 pF = 22 nF Capacitance tolerance K 10% (standard) Internal coding
X
1
103
K
0
60
Packaging 60 cardboard tape, 180-mm reel 62 blister tape, 180-mm reel 70 cardboard tape, 330-mm reel 72 blister tape, 330-mm reel
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer ceramic capacitors MLSC; X7R
Features Two series-connected ceramic capacitors in a single component The MLSC thus satisfies the requirements of the automobile manufacturers for applications on the battery / generator (e.g. clamp 30 or clamp 15) in a single component. Reduction of the effects of a bending fracture placement fracture solder-shock crack thanks to a lower probability of a short circuit. Evaluation criteria: Insulation resistance >10 k after the following treatment bending until crack humidity tests (85 C/85% RH, rated voltage), 14 days The breakdown voltage of MLSCs in the case of a typical bending crack is still greater than five times the rated voltage. Both undamaged and cracked MLSCs are capable of fulfilling the requirements to ISO 7637 for 12 V automotive power systems, including load-dump and jump-start requirements (24 V/1 h and 36 V/1 h). Based on AEC-Q200 Rev-C Applications Automobile electronics for direct connection to the car battery or generator at positions with "stranding potential" as RF filters in small motors (e.g. electrically operated windows) Power electronics (e.g. DC/DC converters) Smoothing capacitors (e.g. on the rechargeable battery in mobile equipment) Cautions A short circuit cannot be completely excluded. The use of MLSCs does not therefore result in 100% fail-safe operation, but in the event of a crack the probability of a short circuit can be greatly reduced. In the event of an untypical (bending) crack formation (e. g. double-sided crack or extreme mounting crack) and other mechanical or thermal damage to the capacitor, the capacitor may have a low ohmic state.
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer ceramic capacitors MLSC; X7R
Termination Nickel barrier terminations (Ni) for lead-free soldering Options Alternative capacitance values and tolerances available on request Delivery mode Cardboard and blister tape (blister tape for chip thickness 1.2 0.1 mm), 180-mm and 330-mm reel available Electrical data Temperature characteristic Max. relative capacitance change Climatic category Standard Dielectric Rated voltage1) Test voltage Capacitance range Dissipation factor Insulation resistance2) Insulation resistance2) Time constant2) Time constant2) Operating temperature range Ageing3) X7R within 55 ... +125 C C/C 15 (IEC 60068-1) 55/125/56 EIA Class 2 VR 50, 100 Vtest 2.5 VR/5 s CR 1 nF ... 100 nF (E6) (limit value) tan < 25 10-3 (at +25 C) Rins > 105 (at +125 C) Rins > 104 (at +25 C) > 1000 (at +125 C) > 100 Top 55 ... +125 yes
%
VDC VDC
M M s s C
1) Note: No operation on AC line. 2) For CR >10 nF the time constant = C Rins is given. 3) Refer to chapter "General technical information", "Ageing".
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer ceramic capacitors MLSC; X7R
Capacitance tolerances Code letter Tolerance K (standard) 10%
Dimensional drawing
Dimensions (mm) Case size l w th k (inch) (mm) 0603 1608 1.60 0.15 0.80 0.10 0.80 0.10 0.10 - 0.40 0805 2012 2.00 0.20 1.25 0.15 1.35 max. 0.13 - 0.75
Tolerances to CECC 32101-801
Please read Cautions and warnings and Important notes at the end of this document.
Page 6 of 16
Multilayer ceramic capacitors MLSC; X7R
Recommended solder pad
Recommended dimensions (mm) for reflow soldering Case size (inch/mm) 0603/1608 0805/2012 Type single chip single chip A 0.60 ... 0.70 0.60 ... 0.70 C 1.80 ... 2.20 2.20 ... 2.60 D 0.60 ... 0.80 0.80 ... 1.10
Recommended dimensions (mm) for wave soldering Case size (inch/mm) 0603/1608 0805/2012 Type single chip single chip A 0.80 ... 0.90 0.90 ... 1.00 C 2.20 ... 2.80 2.80 ... 3.20 D 0.60 ... 0.80 0.80 ... 1.10
Termination
Please read Cautions and warnings and Important notes at the end of this document.
Page 7 of 16
Multilayer ceramic capacitors MLSC; X7R
Product range for MLSC chip capacitors, X7R Size inch (l x w) mm (l x w) Type CR \ VR (VDC) 1.0 nF 1.5 nF 2.2 nF 3.3 nF 4.7 nF 6.8 nF 10 nF 15 nF 22 nF 33 nF 47 nF 68 nF 100 nF 50
0603 1608 B37931X 100 50
0805 2012 B37941X 100
Please read Cautions and warnings and Important notes at the end of this document.
Page 8 of 16
Multilayer ceramic capacitors MLSC; X7R
Ordering codes and packing for MLSC, X7R, 50 VDC, nickel barrier terminations Chip thickness Cardboard tape, 180-mm reel ** 60 pcs./reel 4000 4000 4000 4000 4000 4000 4000 4000 Cardboard tape, 330-mm reel ** 70 pcs./reel 16000 16000 16000 16000 16000 16000 16000 16000 3000 3000 12000 12000 Blister tape, Blister tape, 180-mm 330-mm reel reel ** 62 pcs./reel ** 72 pcs./reel
CR
Ordering code
mm 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 1.2 0.1 1.2 0.1
Case size 0603, 50 VDC 1.5 nF B37931X5152K0** 2.2 nF B37931X5222K0** 3.3 nF B37931X5332K0** 4.7 nF B37931X5472K0** 6.8 nF B37931X5682K0** 10 nF B37931X5103K0** Case size 0805, 50 VDC 33 nF B37941X5333K0** 47 nF B37941X5473K0** 68 nF B37941X5683K0** 100 nF B37941X5104K0**
Ordering codes and packing for MLSC, X7R, 100 VDC, nickel barrier terminations Chip thickness Cardboard tape, 180-mm reel ** 60 pcs./reel 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 Cardboard tape, 330-mm reel ** 70 pcs./reel 16000 16000 16000 16000 16000 16000 16000 16000 16000 16000
CR
Ordering code
mm 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1 0.8 0.1
Case size 0603, 100 VDC 1.0 nF B37931X1102K0** Case size 0805, 100 VDC 1.0 nF B37941X1102K0** 1.5 nF B37941X1152K0** 2.2 nF B37941X1222K0** 3.3 nF B37941X1332K0** 4.7 nF B37941X1472K0** 6.8 nF B37941X1682K0** 10 nF B37941X1103K0** 15 nF B37941X1153K0** 22 nF B37941X1223K0**
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer ceramic capacitors MLSC; X7R
Typical characteristics1) Capacitance change C/C25 versus temperature T
Capacitance change C/C0 versus superimposed DC voltage V
Impedance |Z| versus frequency f for case size 0603
Impedance |Z| versus frequency f for case size 0805
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and Important notes at the end of this document.
Page 10 of 16
Multilayer ceramic capacitors MLSC; X7R
Typical characteristics1) Dissipation factor tan versus temperature T
Insulation resistance Rins versus temperature T
Capacitance change C/C1 versus time t
1) For more detailed information on frequency behavior and characteristics see www.epcos.com/mlcc_impedance.
Please read Cautions and warnings and Important notes at the end of this document.
Page 11 of 16
Multilayer ceramic capacitors MLSC; X7R
Cautions and warnings How to select ceramic capacitors Remember the following when selecting ceramic capacitors: 1. Ceramic capacitors that must fulfill high quality requirements must be qualified based on AEC-Q200 Rev-C. 2. When ceramic capacitors are used at the connection to a battery or power supply (e.g. clamp 15 or 30 in an automobile) or for safety-relevant applications, two single ceramic capacitors should be connected in series. Alternatively a ceramic capacitor with integrated series circuits should be used in order to reduce the possibility of a short circuit caused by a fracture. The MLSC from EPCOS contains such a series circuit in a single component. 3. The use of multilayer varistors (MLVs) is recommended for ESD protection (see chapter "Effects on mechanical, thermal and electrical stress", section 1.4). 4. Additional stress factors such as continuous operating voltage or application-specific derating must be taken into account in the selection of components (refer to chapter "Reliability"). Recommendations for the circuit board design 1. Components with an optimized geometrical design are preferable where permitted by the application. 2. Use at least FR4 circuit board material. 3. Geometrically optimized circuit boards are preferable, especially those that cannot be deformed. 4. Ceramic capacitors should be placed with a sufficient minimum distance from the edge of a circuit board. High bending forces may be exerted there when boards are separated and during further processing of a board (e.g. when incorporating it in a housing). 5. Ceramic capacitors should always be placed parallel to the possible bending axis of a circuit board. 6. Screw connections should not be used to fix a board or connect several boards. Components should not be placed near screw holes. If screw connections are unavoidable, they should be cushioned, for instance using rubber pads.
Please read Cautions and warnings and Important notes at the end of this document.
Page 12 of 16
Multilayer ceramic capacitors MLSC; X7R
Recommendations for processing 1. Ensure correct positioning of a ceramic capacitor on the solder pad. 2. Be careful when using casting, injection-molded and molding compounds and cleaning agents. They can damage a capacitor. 3. Support a circuit board and reduce placement forces. 4. Do not straighten a board (manually) if it is distorted by soldering. 5. Separate boards with a peripheral saw, or preferably with a milling head (no dicing or breaking). 6. Be careful when subsequently placing heavy or leaded components (e.g. transformers or snap-in components) because of the danger of bending and fracture. 7. When testing, transporting, packing or inserting a board, avoid any deformation of it so that components are not damaged. 8. Avoid excessive force when plugging a connector into a device soldered onto a board. 9. Only mount ceramic capacitors using the soldering process (reflow or wave) that is permissible for them (see chapter "Soldering directions"). 10. When soldering, select the softest solder profile possible (heating time, peak temperature, cooling time) to avoid thermal stress and damage. 11. Ensure the correct solder meniscus height and solder quantity. 12. Ensure correct dosing of the cement. 13. Ceramic capacitors with external silver-palladium terminations are intended for conductive adhesion - they are not suited for lead-free soldering processes.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
Please read Cautions and warnings and Important notes at the end of this document.
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Multilayer ceramic capacitors MLSC; X7R
Symbols and terms Symbol A C C0 C1 CR C20 C25 C D Ea ESR F f fmeas fres Itest k L N Ploss Qel Q Rins RP RS SV T Tmeas Top Tref Ttest t tr ttest tan English Area Capacitance Initial (original) capacitance Capacitance value after one hour's use Rated capacitance Capacitance at 20 C Capacitance at 25 C Capacitance change Bending displacement Activation energy Equivalent series resistance Force Frequency Measuring frequency Self-resonant frequency Test current Ageing constant Inductance Quantity (integer values) Power dissipation or loss Electrical charge Quality Insulation resistance Parallel resistance Series resistance (circuit resistance) Rate of rise of a voltage pulse Temperature Measuring temperature Operating temperature Reference temperature Test temperature Time Rise time of a voltage pulse Test duration Dissipation factor German Flache Kapazitat Anfangskapazitat Kapazitatswert nach einer Stunde Nennkapazitat Kapazitat bei 20 C Kapazitat bei 25 C Kapazitatsanderung Durchbiegung Aktivierungsenergie Ersatzserienwiderstand Kraft Frequenz Messfrequenz Eigenresonanzfrequenz Prufstrom Alterungskonstante Induktivitat Anzahl (ganzzahliger Wert) Verlustleistung Elektrische Ladung Gute Isolationswiderstand Parallelwiderstand Serienwiderstand Flankensteilheit eines Spannungsimpulses Temperatur Messtemperatur Betriebstemperatur Bezugstemperatur Pruftemperatur Zeit Anstiegszeit eines Spannungsimpulses Prufdauer Verlustfaktor
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Please read Cautions and warnings and Important notes at the end of this document.
Multilayer ceramic capacitors MLSC; X7R
Symbol V V0 Vmeas VR VS VRMS Vtest |Z| 0 r
English Voltage Initial (original) voltage (basic voltage level) Measuring voltage Rated voltage Amplitude of a voltage pulse Measuring (root-mean-square or effective) AC voltage Test voltage Magnitude of impedance (AC resistance) Temperature coefficient Absolute dielectric constant Relative dielectric constant Failure rate Time constant
German Spannung Anfangsspannung (Spannungsgrundpegel) Messspannung Nennspannung Hub des Spannungsimpulses Effektivspannung Prufspannung Betrag der Impedanz (Wechselstromwiderstand) Temperaturkoeffizient Absolute Dielektrizitatskonstante Relative Dielektrizitatskonstante Ausfallrate Zeitkonstante
Abbreviations / Notes Symbol English Lead spacing (in mm) Surface-mounted devices * + German Rasterma (in mm) Oberflachenmontierbares Bauelement
To be replaced by a number in ordering Platzhalter fur Zahl im Bestellnummerncodes, type designations etc. code oder fur die Typenbezeichnung. To be replaced by a letter. All dimensions are given in mm. The commas used in numerical values denote decimal points. Platzhalter fur einen Buchstaben. Alle Mae sind in mm angegeben. Verwendete Kommas in Zahlenwerten bezeichnen Dezimalpunkte.
Please read Cautions and warnings and Important notes at the end of this document.
Page 15 of 16
Important notes
The following applies to all products named in this publication: 1. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. We nevertheless expressly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, EPCOS is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether an EPCOS product with the properties described in the product specification is suitable for use in a particular customer application. 2. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or lifesaving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 3. The warnings, cautions and product-specific notes must be observed. 4. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous). Useful information on this will be found in our Material Data Sheets on the Internet (www.epcos.com/material). Should you have any more detailed questions, please contact our sales offices. 5. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true of the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. The aforementioned does not apply in the case of individual agreements deviating from the foregoing for customer-specific products. 6. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the "General Terms of Delivery for Products and Services in the Electrical Industry" published by the German Electrical and Electronics Industry Association (ZVEI). 7. The trade names EPCOS, BAOKE, Alu-X, CeraDiode, CSMP, CSSP, CTVS, DSSP, MiniBlue, MKK, MLSC, MotorCap, PCC, PhaseCap, PhaseCube, PhaseMod, SIFERRIT, SIFI, SIKOREL, SilverCap, SIMDAD, SIMID, SineFormer, SIOV, SIP5D, SIP5K, ThermoFuse, WindCap are trademarks registered or pending in Europe and in other countries. Further information will be found on the Internet at www.epcos.com/trademarks.
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